The ONYX 21 offers high professional rework capabilities at a favorable price. For smaller printed circuit boards and simple applications with the goal to have high reliable solder results.
ONYX 21 KEY FEATURES SUMMARY
- AXIS MOVEMENTS
motorised Vision- and z-axis, closed loop motion control
- COMPACT, STABLE DESIGN
for smaller boards, but also capable of handling boards up to 300x400mm
- STRONG TOP AND BOTTOM HEATING
2000 W top site heater; 3500 W 300x300mm bottom side preheating
- BOARD COOLING
the board cooling options adds benefits for leadfree soldering and faster process times.
- EXTERNAL SITE SOLDER CLEANING SYSTEM
option for external site solder removal system for redressing after removal of component
- CLOSED LOOP AIRFLOW CONTROL
- STANDARD ZEVAC GAS NOZZLES
- 4 THERMOCOUPLE PORTS
to control process temperatures.
- FORCE MEASUREMENT
Closed loop force control for automatic picking, fluxing, placing and removing.
Available as SFOV or MFOV Version, the Vision System allows viewing of the board layout and the component pattern at the same time, adjustable Vision LED illumination intensity.
The ONYX 21 has been designed according to applications requirements in a compact machine design. The compact machine design nevertheless doesn't make compromise on the functionality: it offers force measurement, strong top and bottom heating, nitrogen connection and modularity as a standard.
STRONG TOP AND BOTTOM HEATING
The preheater 300x300mm offers powerful 3500 W for bottom heating and 2000 W for top heating. Important for higher temperatures and exact temperature profiling for leadfree applications.
EXTERNAL SITE CLEANING OPTION
The external site cleaning option with an adjusted fixed height is outlined for use on the ONYX 21 for contactless site cleaning after removal of a component. The residue solder is removed without touching or damaging the surface of the printed circuit board. The site is cleaned and ready for a new component to be soldered in after applying flux and paste if necessary.
The Z-axes is motorized and places the the component automatically with force in the gramme range onto the board to protect sensitive components.
For controlled and strong preheating and avoiding warpage. With this and the optional board cooling the cycle time can be reduced to a minimum and the temperature profile does meet the requirements even of sophisticated applications.