PARMI SPI HS70 3D Solder Paste Inspection System

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SPI HS70 Series is the next generation fastest in-line Solder paste inspection system in the market. The measuring speed is 100cm2/sec at 13x13um resolution, and 80cm2/sec at 10x10um resolution. It can inspect smaller than 01005 pads and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced based on PARMI’s development of the RSC-6 sensor. Furthermore, there are two kinds of magnification of Camera Lens for the RSC Sensor delivering – 0.42x to 0.6x magnifications providing more control to the engineer.
HS 70 series platforms & mountable panel spec.

SPI HS70 : 420x350mm, thickness 4mm, weight 4kg

SPI HS70L : 590x610mm, thickness 10mm, weight 10kg

SPI HS70D : 340x315mm, thickness 4mm, weight 4kg



Key features of 3D sensor “RSC VI”
  • Best speed at best resolution
  • 100㎠/sec @ 13x13um spatial resolution with RSC VI
  • 80㎠/sec @ 10x10um spatial resolution with RSC VI
  • Shadow free by dual laser projection
  • Real time PCB warp tracking & Warp measuring
  • Real 3D shape & color 2D image
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