Machine

High-quality machines for the electronics and semiconductor industries.

Features

  • Realizing of speeding up by latest 3D unit. Achieving of 0.41 sec / FOV and 34% improvement comparing with previous model.
  • Height resolution 0.1 μm, Repeatability 10 μm *Realizing of significant precision improvement.With new technology development, acquire clear and high-precision 3D image.
  • In addition to the previous 2D template and process mode, added newly 3D template mode.Furthermore, developping of new algorithm for fillet inspection.
  • *0402 chip

Specification

Model name

RV-2-3D

PWB size

50mm x 50mm - 410mmx300mm
50mm x 50mm - 630mm x 300mm ( longer sized PWB)*

FOV(optimum)

P-3D AOI

0.41s / frame

Inspection resolution

15μm ( Standard resloution ), 10μm ( High resolution )*

Item of inspection

Missing component,Position displacement, Polarity, Front/rear reversal, Unsoldered,Bridge, Quantity of solder, Lack of insertion component, Character recognition*

By Brand