Machine

High-quality machines for the electronics and semiconductor industries.

VAPOUR PHASE PROFILING

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Whether batch or inline, atmospheric or vacuum, the SolderStar solution for Vapour Phase machines allows engineers to understand and control their production vapour phases processes.

Vapour phase soldering is not a new process, and with advanced machines available it is common place where throughput is not the main concern. Like all production processes, without proper control, problems will occur such as tombstoning or component positioning problems due to overly aggressive vacuum settings. The Solderstar system is specifically developed to pass through the VP process with the electronic assembly to allow the engineer to measure and understand this process fully.

The Solderstar VP systems uses a specially developed two-piece protective shield, fully machined from aluminium this enclosure is both ‘O’ ring sealed and Teflon coated to maximise the protection of the measuring instrument while passing through this harsh environment process.

Low Impact Design

This aluminium design provides an extremely low mass solution, minimising any possible impact on the process temperatures. Once retrieved from the process, the hot shield can be opened and the instrument removed minimising the potential for instrument damage and reducing overall cool down cycle. Data captured can then be downloaded to a PC for analysis by the engineer.

The WaveShuttle Pro is supplied with Wave Central PC Software, a dedicated package for the analysis of all key wave soldering parameters. Based on SolderStar’s interface and navigation system it allows users of other SolderStar products to perform detailed wave solder analysis with minimal training

An innovative 2.4Ghz telemetry link is optionally available for this system, a ‘self healing’ mesh network technology has been employed which allows data to be fed live from within the process chamber, even within the vacuum stage allowing for precision monitoring and setup of actual product temperatures.

SYSTEM FEATURES

  • Up to 16 measurement channels for thermal profiling of the most complex PCB assemblies
  • Profile Batch or Inline Systems
  • Suitable for machines with vacuum stages
  • Low mass thermal shield provides minimal impact to process
  • Teflon coating to resist Galden build-up
  • Two piece shield design to allow faster cool down cycles
  • USB Recharge & communications
  • Live product temperatures via optional 2.4Ghz Telemetry Link

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